HANDLING PRECAUTIONS |
Please use the Epson Toyocom’s product under the conditions provided in respective specifications and catalogues.
Epson Toyocom’s products are designed and manufactured to satisfy its specification, and quality and reliability of the products are ensured through our stringent reliability tests before shipments. However, it is essential to store, mount, and use the products under proper conditions in order to keep the quality and reliability. Please pay careful attention to following precautions and use the products under the optimal conditions. Epson Toyocom shall not be responsible for any deteriorated performance of the products caused by any application or usage of the products adopted at customer's own discretion.
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Common points for all products |

| 1. |
Shock resistance |
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Crystal products may be damaged under some conditions, such as dropping from desks or receiving shocks during mounting. Please do not use the products if products have received any excessive shocks.
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Exposure to radiation can cause deterioration in performance, so avoid irradiation. |
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Do not use or store the product in a pH range that may cause corrosion or dissolution of the materials or packaging. |
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Do not use an adhesive that may cause corrosion of the packing materials, terminals, components, glass materials, and vapor deposited materials used in the products. (For example, a chlorine-based adhesive may corrode the metal parts “lid” of a crystal unit to diminish the hermetic qualities, lowering the performance.) |
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Do not use products in halogen gas. Even a slight amount of halogen gas, such as that found in chlorine gas in the air or in metal parts used in the package, may corrode. Also, do not use any resin that emits halogen gas. |
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Excessive levels of static electricity may damage the product, please treat it in anti-static condition. Choose conductive materials for containers and packing materials. Use a soldering gun and a measurement circuit free from high-voltage leakage and provide grounding conduction when working with them.
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| 7. |
When designing |
| 7.1 |
The affect of mechanical vibration |
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While there is any given shock or mechanical vibration periodically to crystal products, such as, a piezo sounder, a piezo buzzer, and speaker, to crystal products, output frequency and amplitude can be changed. Especially the quality of telecommunication equipment could be affected by this phenomenon. Although Epson Toyocom’s crystal products are designed to minimize the effect of mechanical vibration, Epson Toyocom recommends to check them in advance and to follow the PCB design guidelines as below. |
| 7.2 |
PCB design guidelines |
| (1) |
Ideally, the mechanical buzzer source should be mounted on a separate PCB from the crystal device. It is advisable to use cushion or cutting PCB, if you mount on same PCB. Traveling mechanical vibration differs when applied to the PCB only vs. inside the body. It is advisable to confirm characteristics in the body |
| (2) |
Refer Epson Toyocom’s recommend footprint when designing. |
| (3) |
In case of using solder flux, please use it on the basis of the flux of the JIS standard (JIS C 60068-2-20/IEC 60,068-2-20). |
| (4) |
Please use the solder on the basis of the JIS standard (JIS Z 3282, Pb content 1000ppm, 0.1wt% or less) lead -free solder. |
| (1) |
Storing the crystal products under higher or lower temperature or high humidity for a long period may affect frequency stability or solderability. Please store the crystal products at the normal temperature and humidity, avoid storing them for a long period and mount them as soon as possible after unpacking.
Normal temperature and humidity:
Temp,+15°C to+35°C, humidity 25 % RH to 85 % RH(refer to the standard conditions of test site JIS C 60068-1/IEC 60068-1) |
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| (2) |
Please carefully handle the inner and outer boxes and reel. External pressure may cause deformation of reel and tape. |
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